https://my.ebook5.net/techno-kitagawa/uQz3En/

# 【KGS】Thermal Management Solutions(No.20301008B)

## Page 01
![Page 01の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000001.jpg)

【ページ内のテキスト情報】

ThermalManagementSolutions

## Page 02
![Page 02の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000002.jpg)

【ページ内のテキスト情報】

ProductLinesSilicone-FreeThermalInterfaceMaterialsp.3p.4p.5p.6p.7COOLPROVIDETM/CPVGCOOLPROVIDETM/CPSH,CPVHCOOLPROVIDETM/ＣＰＶＰCOOLPROVIDETM/CPSS,CPVTCOOLPROVIDETM/CPLKp.8COOLPROVIDETM/EMPV4，EMPV5p.9THERMALDAMPER/CPAGSilicone-BasedThermalInterfaceMaterialsFirstSolutionProposerp.10COOLPROVIDETM/SPVS,SPVSpecialThermalInterfaceMaterialsp.11HEATSPREADERSHEET/HSDCERACOLD/CECDp.12IconsThermal+EMCDualFunctionThermalandEMCEMISuppressionandThermalPadHighConductivityHighThermalConductivity(3W/m·Korhigher)HighheatdissipationfromICsSoftSoft(ASKERC15orless)FordevicescontainingmodulesaffectedbypressureandcompressionSolidPhaseChangeGelPhase-ChangeUponapplicationhigh-viscositygel-likematerialworksasagap-filler高減衰HighdampingDualFunctionVibrationDamperandThermalSuppressvibrationfrequencyandtransferheat

## Page 03
![Page 03の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000003.jpg)

【ページ内のテキスト情報】

ProductSpotlightCOOLPROVIDETM/CPSHHighConductivityP.45W/m・KSilicone-FreeThermalPadFeatures■Highperformance(5W/m・K)andsoft(ASKERC32)silicone-freethermalpad.■Crowdsoutairbubblestoreducethermalresistance.■Nosiloxaneoutgassingoroilbleed.■Operatingtemperature:-40~125̊C■Customprofileavailableuponrequest.COOLPROVIDETM/CPVPSilicone-FreePutty-LikeThermalPadHighConductivityUltrasoftP.5※CPVP:2.0W/ｍ・K■■■■■FeaturesLowcompressionforceandexcellentstressrelaxation.Supercompliable(ASKERC0)materiallayeredbetweenthinpermanentPETfilmandlighttackylayerforeasyhandling.Noconcernsforsiloxaneoutgassingoroilbleeding.Operatingtemperature:-40~125̊CCustomdie-cuttingavailableuponrequest.COOLPROVIDETM/EMPV5Thermal+EMCP.8BroadbandEMIAbsorberandThermalPadforHigherFrequenciesFeatures■Suppressesnoisefrom500MHzto3GHz.■Silicone-free,nosiloxaneoutgassing.■Operatingtemperature:-40~+110C■Thermalconductivity:0.8W/m・K■Permeability@10MHz:7

## Page 04
![Page 04の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000004.jpg)

【ページ内のテキスト情報】

SafetyGuidelinesPleasereviewpriortousingourproducts.1.Thecontentsorproductsdescribedinthiscatalogmaychangewithoutnoticeduetoproductimprovementsandspecificationupdates.2.Allstatements,specifications,properties,technical.information,andrecommendationshereinarebasedontests;however,theaccuracyandcompletenessofthevaluesarenotguaranteed.3.Beforeexportinganyproductfeaturedinthiscatalog,ensurecompliancewiththe"ForeignExchangeandForeignTradeLaw."Ifcargofallsunderthisregulation,anappropriateexportlicenseisnecessary.Additionally,beawarethatcertaincountriesandregionshaverestrictionsonthesaleoftheseproducts.4.KGSassumesnoresponsibilityforanyissuesrelatedtoourintellectualpropertyrightsorthird-partyrightsthatariseaftertheuseofanyproductlistedinthiscatalog.Furthermore,KGSdoesnotauthorizethelicensingoftheserights.5.Thecontentofthiscatalogappliessolelytoproductspurchaseddirectlyfromusorthroughauthorizedagencies.Ifnoinformationregardingtheapplicableconditionsisprovided,oriftheproductswerepurchasedfromathirdparty,theconditionsoutlinedinthecatalogdonotapply.6.Productsinthiscatalogmaynotbeavailableforsaledependingoncountryorregion.7.Productslistedinthiscatalogaredesignedandtestedforgeneral-purposeapplicationscommonlyfoundinvariouselectronicdevicesandequipment,suchasAVsystems,officeequipment,computerperipherals,communicationdevices,homeappliances,industrialrobots,entertainmentsystems,personal-usedevices,measurement/testunits,andsimilarapplications.Theyareintendedforuseundernormaloperatingconditionsinthesegeneralelectronicdevicesandequipment.Thiscatalogdoesnotguaranteetheproduct'sperformanceorquality,particularlyiftheproductisintendedforuseinhigh-safetyandhigh-reliabilityorotherveryuniqueapplications,orinsituationswheredevicefailure,malfunction,ormisusecouldposerisksorharmtohumanlifeandhealth,causepropertydamage,orhavesignificantsocialimpact.Pleaseconsultusbeforeusingourproductsinthesecases,especiallyifyourrequirementsexceedtheproduct'snormalperformancerangeandconditionsspecifiedinthecatalog,orifyouhavespecificapplicationrequirements.①aerospaceequipment,②transportationequipment(automobiles,trains,ships,andsimilarvehicles),③nuclearpower-relatedequipment,④medicalequipment,⑤militaryequipment,⑥underwater/submarineequipment,⑦powergenerationcontrolequipment,⑧publicinformationprocessingequipment,⑨transportationcontrolequipment,⑩electricheatingequipment,combustionequipment,⑪disasterprevention,crimepreventionequipment,⑫varioussafetydevices,⑬otherusagedeemedtobeuniqueapplications.Whiledesigningtheequipmenttousetheproductinthiscatalog,pleasesecureaprotectionorabackupinaccordancewiththeintendeduseofthedevice.8.Whilewehaveimplementedcomprehensivemeasurestoenhancethesafety,quality,andreliabilityofourproduct,improperusemaypotentiallyresultinpersonalinjuries,firehazards,orsocietallosses.Contactusforguidanceonthecorrectuseofourproducts.Unauthorizedreproductionorduplicationofthecontentsofthiscatalogisstrictlyprohibited.[HandlingProcedures]●Duringinstallation,avoidcontactwiththeheatingelementtopreventanyburnsrisks.●Ensurethesurfaceisfreeofdirt,dust,oil,ormoisturebeforeinstalling.●Keepprotectivereleaselinerinplaceuntilusetopreventcontaminationfromdebrisanddust.●Productthicknessindicatedinthecatalogdoesnotincludetheprotectivereleaseliner.●StoreproductsatroomtemperatureinalowhumidityenvironmentandavoiddirectsunlightorUVrays.●Phase-changegelsmustbestoredbelow35℃(Recommendedtemperatureis25℃).●Duetotheinherenttackinessofourproducts,removalafterheatingorcompressingmaybechallenging.

## Page 05
![Page 05の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000005.jpg)

【ページ内のテキスト情報】

ApplicationsChassisPCB基板TIMusedbetweenheatsourceandheatsinkHeatsinkヒートシンクHeatsourceIC発熱ICHeatsourceICPCBTIMunderneathPCBbetweenheatsourceandmetalchassisMetalboardHeatsourceICPCBTIMusedbetweenChassisheatsourceandmetalchassisPCBHeatsourceICTIMusedbetweenheatsourceandmetalboardHeatdissipationsheet筐体ChassisHeatsourceIC熱拡散シートPCBHeatdissipationsheetHeat発熱ICsourceICMetalboardPCB基板HeatspreaderusedformodulewheretemperaturedifferenceisnotpermittedHeatspreaderusedforchassiswhereheatremainsSecondaryprocessingCutting(Round,square,specialshape,kiss-cutting,etc.)Customizedcuttingformulti-layeredproductsOtherprocessing(Variousotherprocessesarepossible.Pleasefeelfreetocontactoursales.)

## Page 06
![Page 06の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000006.jpg)

【ページ内のテキスト情報】

Silicone-FreeThermalInterfaceMaterials1PropertiesofThermalConductiveMaterials(Silicone-Free)※1)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.※2)0.5F：ASKERC55※3)FlammabilityV-0isnotappliedto0.5F.※4)Superlowhardnesslayer.※5)JISK6253compliant※6)t=0.5:200×200(Thevaluesbelowarenotguaranteed.)CPSH-F5.03.65Lightgreen0.5／1.0／1.5／2.02.5／3.0／3.5／4.02.8932※２640.37101.0×10112.21.418.20.01V-0※3-40～125200×500CPSH5.03.65Lightgreen1.0／1.5／2.02.5／3.0／3.5／4.02.8932640.21201.0×10112.01.218.80.01Ｖ-0equivalent-40～125200×500CPVH-F3.02.1Brown0.5／1.0／1.5／2.02.5／3.0／3.5／4.02.3315470.254.01.0×10112.72.118.20.08V-0-40～125200×500CPVH3.02.1Brown2.3315470.15741.0×10113.11.919.60.08V-0-40～125200×5002.0／3.0／4.0TesttypeColorThicknessHardnessLosstangentFlammabilityStandardーーJISZ8807JISK7312ASTMD2240JISK6251JISK6251UL94ーーJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)UnitW/m・KーｍｍーASKERCShore00MPa％Ω・cmkV/mmkV/mm1MHz1MHzー℃ｍｍThermalConductivityJISK6911compliantJISC2110-1compliantJISC2110-1compliantSpecificGravityVolumeResistivityOperatingtempTensilestrengthBreakdownvoltageWithstandingvoltageDielectricconstantCompanystandardCompanystandardAvailablemax.dimension※1Elongationrate(Thevaluesbelowarenotguaranteed.)TesttypeColorThicknessHardnessLosstangentStandardーーJISZ8807JISK7312ASTMD2240JISK6251JISK6251ーーJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)UnitW/m・KーｍｍーASKERCShore00MPa％Ω・cmkV/mmkV/mm1MHz1MHz℃ｍｍThermalConductivityJISK6911compliantJISC2110-1compliantJISC2110-1compliantSpecificGravityVolumeResistivityOperatingtempTensilestrengthBreakdownvoltageWithstandingvoltageDielectricconstantCompanystandardCompanystandardUL94ーFlammabilityAvailablemax.dimension※1EMPV4-F1.51.3Black1.0／1.5／2.02.5／3.0／3.53.5540700.51161.0×10126.04.212.70.13V-0equivalent-40～110200×500EMPV5-Fー0.8Black1.0／1.5／2.02.5／3.0／3.5ー3060ーー1.0×10118.85.0ーー-40～110200×500V-0equivalentCPAG-T0.8ーBlack0.5／1.0／2.03.0／4.0／5.0ー70DurometertypeＡ64※5ーー5.54×1011ーーーー-10～100345×345ーCPAG0.8ーBlack0.5／1.0／2.03.0／4.0／5.0ー70DurometertypeＡ64※5ーー5.54×1011ーーーーV-1equivalent(t2.0mm)V-0equivalent(t3.0-5.0mm)-10～100345×345※6ElongationrateCPLK-F２．０1.4Purple2.030600.399.11.0×10116.63.05.400.003V-0equivalent-40～125200×5001.0／1.5／2.0(Thevaluesbelowarenotguaranteed.)CPVT-F2.0１．４Ｇｒｅｅｎ0.10／0.150.20／0.251.94３４ー4.38４．９1.0×101311.15.06.690.08-20～100190×490TesttypeColorThicknessHardnessLosstangentStandardーーJISZ8807JISK7312ASTMD2240JISK6251JISK6251ーーJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)UnitW/m・KーｍｍーASKERCShore00MPa％Ω・cmkV/mmkV/mm1MHz1MHz℃ｍｍThermalConductivityJISK6911compliantJISC2110-1compliantJISC2110-1compliantSpecificGravityVolumeResistivityOperatingtempTensilestrengthBreakdownvoltageWithstandingvoltageDielectricconstantCompanystandardCompanystandardAvailablemax.dimension※1ElongationrateCPVP-F2.01.4Darkgreen／White1.0／1.5／2.0／3.04.0／5.0／6.0ー0※４ーーー1.0×1011ーーーー-40～125200×500CPVP-30-Fー３．０※4Green／White2.627※４１８※４０．３８７．９1.0×1011４．4３．５１１．９０．０１-40～1252００×5００CPＳＳ-F2.01.４Darkgreen1.0／1.5／2.02.5／3.0／4.01.928330.28８．９1.0×10123.52.814.60.09V-2(t1.0-3.0mm)V-0(t4.0mm)-40～1002００×5０0CPＳＳ2.01.４Darkgreen3.0／4.01.92833ーー1.0×1012ーーー――-40～1002００×5００V-0Ｖ-0ー3.0／4.0UL94ーFlammability

## Page 07
![Page 07の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000007.jpg)

【ページ内のテキスト情報】

PropertiesofThermalConductiveMaterials(Silicone-Based)TesttypeThermalConductivityColorThicknessUnitStandardJISR2616（Hot-wiremethod）W/m・KISO22007-2(HotDiscmethod)ーーｍｍSpecificGravityーJISZ8807HardnessASKERCShore00JISK7312ASTMD2240TensilestrengthMPaJISK6251Elongationrate％JISK6251VolumeResistivityΩ・cmJISK6911compliantBreakdownvoltagekV/mmJISC2110-1compliantWithstandingvoltagekV/mmJISC2110-1compliantDielectricconstant1MHzCompanystandardLosstangentFlammability1MHzーCompanystandardUL94Operatingtemp℃ーAvailablemax.dimension※1ｍｍーー(Thevaluesbelowarenotguaranteed.)SPVSSPV5.03.03.42.3GreenGreen0.5／1.0／1.52.7570860.78163.0×10113.21.813.70.06V-0※2-20～125200×5000.5／1.02.240690.49５９2.0×10110.690.335.10.07V-1(ｔ0.5ｍｍ)-20～125200×500※1)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.※2)FlammabilityV-0isnotappliedtot=1.5.2Silicone-BasedThermalInterfaceMaterialsComparisonofProductSeries●Silicone-free●Silicone-basedHardness(ＡＳＫＥＲC)010203040506070800Softer●CPVP(p.5)●ＣＰVG-30(p.9)●ＣＰＳSCPSS(p.6)●CPVP-30(p.5)●ＣＰＶHCPVH(p.4)●●ＣＰLK(p.7)EMPV5●ＣＰＶTＣＰＶＴ(p.6)●CPSH(p.4)(p.8)●EMPV4●SPV(p.10)(p.8)●SPVS(p.10)Higherthermalconductivity１2345ThermalConductivity(W/m・Ｋ)HotDiscmethod※CPVPisshownforsuperlowhardnesslayeronly

## Page 08
![Page 08の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000008.jpg)

【ページ内のテキスト情報】

3Silicone-freeCOOLPROVIDEＴＭ/CPVGSingle-liquidthermalputtydesignedfordispensingSilicone-FreeThermalInterfaceMaterials■ResultsofdriptestOthercompany’sgreaseCPVG-30Features■Singleliquidputtydoesnotdripevenwhenthicklycoated.■UsefultofillgapsbetweenheatspreadersandICsofvariousheights.CPVG-30：GAP１ｍｍorless■PuttyTIMappliesverylowforceaftercompression.(10%orlessascomparedtothermalpads)■Silicone-freeTIMgeneratesnosiloxanegasandhaslowoilbleeding.TesttypeThermalConductivityt1.0mmThermalresistancet0.3mmt0.1mmColorSpecificGravity0.5[1/s]Viscosity1.0[1/s]VolumeResistivityBreakdownvoltageUnitW/m・K℃/WーーPa・sΩ・cmkV/mm(Thevaluesbelowarenotguaranteed.)StandardCPVG-30ISO22007-2(HotDiscmethod)3.00.33ASTMD54700.080.01ーGrayJISZ88072.9ASTMD18243,300compliant2,500JISK6911compliant1.0×109JISK6911compliant8drippingobservednodrip500MHzRelativepermittivity1GHzーーCompanystandardCompanystandard8.988.88【Testconditions】Temperature：125℃Time：1000ｈCoatingthickness：t=1mmMaterials:Glass+AluminumplateFlammabilityOperatingtempProductformwhensuppliedー℃ーUL94ーーV-0equivalent-40～125Cartridge:330ml■BenefitsofCPVG(PuttyTIM)andtheloadonICs①SinglesheetTIM②MultipleTIMs③CPVGputty■CompressionForceComparisonbetweenCPVGPuttyandThermalPads100������������������������908070StressedcomponentsWorkabilityLoadonICOperationsissuesduetodifferentpadheightsandcutsizesGoodperformance!①②③〇××△〇〇CPVGputtyeasilyappliedatspecificlocationsLowloadonICs,sincetheputtyspreadsintogapswhencompressedCompressionforce(N)605040302019.458.9③CPVGputtyasapplied③CPVGputtyasassembled1000.7CPVH(2.2W/m・K)CPVG-30(3.0W/m・K)CPSH(3.7W/m・K)KGSwillprovidesupporttoevaluateandverifythebestdispensingmethodforyourspecificapplication.※1)Thethermalconductivityofeachproductismeasuredbythehotdiskmethod.※2)Compressionpropertytest＜Testconditions＞•Sampledimensions：□10mm×10mm（t2mm）•Compressionrate：20％compressed

## Page 09
![Page 09の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000009.jpg)

【ページ内のテキスト情報】

Silicone-FreeThermalInterfaceMaterials4COOLPROVIDETM/CPSHBoth-sidetackytype／ＣＰＳＨReleaselinerReleaselinerOne-sidetackytype／CPSH-FThin,permanentPETfilmAcrylicthermalconductivelayerReleaselinerFeatures5W/m・KSilicone-FreeThermalPadHighperformance(5W/m・K)andsoft(ASKERC32)silicone-freethermalpad.Crowdsoutairbubblestoreducethermalresistance.Nosiloxaneoutgassingoroilbleed.Operatingtemperature:-40~125̊CCustomprofileavailableuponrequest.■■■■■AcrylicthermalconductivelayerHighConductivityHighConductivity(Thevaluesbelowarenotguaranteed.)StandardーJISZ8807JISK7312ASTMD2240JISK6251JISK6251JISC2134UL94ーーCPSH-F5.03.６５Lightgreen0.5／1.0／1.5／2.02.5／3.0／3.5／4.02.8932※1640.37101.0×10112.21.4６００≦CTI(t=4.0mm)18.20.01V-0※2-40～125200×500CPSH5.03.６５Lightgreen1.0／1.5／2.02.5／3.0／3.5／4.02.8932640.21201.0×10112.01.2６００≦CTI(t=4.0mm)18.80.01Ｖ-0equivalent-40～125200×500mmーUnitーーASKERCShore00MPa％Ω・cmkV/mmkV/mmー1MHz1MHzー℃mmW/m・KJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)TesttypeColorTrackingresistanceLosstangentFlammabilityOperatingtempThermalConductivityHardnessThicknessSpecificGravityTensilestrengthVolumeResistivityBreakdownvoltageWithstandingvoltageDielectricconstantJISK6911compliantJISC2110-1compliantJISC2110-1compliantCompanystandardCompanystandard※1)0.5F:ASKERC55※2)FlammabilityV-0isnotappliedto0.5F.※3)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.Availablemax.dimension.※1ElongationrateBoth-sidetackytype／CPVHReleaselinerReleaselinerOne-sidetackytype／CPVH-FThin,permanentPETfilmReleaselinerCOOLPROVIDETM/CPVH3W/m・Kthermalpad(ASKERC15)forhighoperatingtemperatureapplicationsFeatures■■■■AcrylicthermalconductivelayerAcrylicthermalconductivelayerHighConductivityHighConductivityUltrasoftUltrasoft(Thevaluesbelowarenotguaranteed.)StandardーJISZ8807JISK7312ASTMD2240JISK6251JISK6251JISC2134UL94ーーCPVH-F3.02.1Brown0.5／1.0／1.5／2.02.5／3.0／3.5／4.02.3315470.254.01.0×10112.72.1600≦CTI(t=4.0mm)18.20.08V-0-40～125200×500mmーCPVH3.02.1Brown2.3315470.15741.0×10113.11.9600≦CTI(t=4.0mm)19.60.08V-0-40～125200×5002.0／3.0／4.0JISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)UnitーーASKERCShore00MPa％Ω・cmkV/mmkV/mmー1MHz1MHzー℃mmW/m・KTesttypeColorTrackingresistanceLosstangentFlammabilityOperatingtempThermalConductivityHardnessThicknessSpecificGravityTensilestrengthVolumeResistivityBreakdownvoltageWithstandingvoltageDielectricconstantJISK6911compliantJISC2110-1compliantJISC2110-1compliantCompanystandardCompanystandard※1)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.Availablemax.dimension.※1ElongationrateSoftandcompilable(ASKERC15)siliconefreethermalpadhelpstocrowdoutairbubblesandreducethermalresistance.Nosiloxaneoutgassingoroilbleed.Operatingtemperature:-40~125̊CCustomprofileavailableuponrequest.Silicone-free

## Page 10
![Page 10の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000010.jpg)

【ページ内のテキスト情報】

５Silicone-freeCOOLPROVIDEＴＭ/CPVPHighConductivityUltrasoftSilicone-FreeThermalInterfaceMaterialsSuperlowhardnesslayerEasypeelinglayerThin,permanentPETfilmAcrylicthermalconductivelayerReleaseliner2-layerputty-likethermalpadwithexcellentstressrelief■■■■■FeaturesLowcompressionforceandexcellentstressrelaxation.Supercompliable(ASKERC0)materiallayeredbetweenthinpermanentPETfilmandlighttackylayerforeasyhandling.Noconcernsforsiloxaneoutgassingoroilbleeding.Operatingtemperature:-40~125̊CCustomdie-cuttingavailableuponrequest.TesttypeThermalConductivityColorThicknessSpecificGravityHardnessTensilestrengthElongationrateVolumeResistivityTrackingresistanceBreakdownvoltageWithstandingvoltageDielectricconstantLosstangentFlammabilityUnitStandardJISR2616（Hot-wiremethod）W/m・KISO22007-2(HotDiscmethod)ーーーｍｍJISZ8807ーJISK7312ASKERCASTMD2240Shore00JISK6251MPaJISK6251％JISC2134Ω・cmJISK6911compliantーJISC2134JISC2110-1kV/mmcompliantkV/mmJISC2110-1compliant1MHzCompanystandard1MHzCompanystandardーUL94※CPVP:2.0W/ｍ・K（Thevaluesbelowarenotguaranteed.）CPVP-FCPVP-30-F2.0ー1.43.0※2Darkgreen／WhiteGreen／White1.0／1.5／2.0／3.03.0／4.04.0／5.0／6.0ー2.620※２7※２ー18※２ー0.38ー7.91.0×10111.0×1011600≦CTI(t=6.0mm)ーー4.4ー3.5ー11.9ー0.01V-0V-0Operatingtemp℃ー-40～125-40～125Availablemax.dimension.※1ｍｍー200×500200×500※1)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.※2)Superlowhardnesslayer■Compressivestressrelaxationproperties●CPVP-F●CPVP-30-FCompressionforce(N/cm2)1816Compressionforce14Stressrelaxation1210864200102030405060Compressibility(％)Compressionforce(N/cm2)40Compressionforce3530Stressrelaxation25201510500102030405060Compressibility(%)〈Testconditions〉Sampledimensions：□10mm(t=4.0mm)Cross-headspeed：1mm/minCompressionplatematerialsUpper:StainlesssteelΦ28mmLower:GoldplatedcopperΦ106mm※Compressionforcevaluesarethelargestloadimmediatelyaftercompression.※Stressrelaxationvaluesareloadafter3minutesofcompression.

## Page 11
![Page 11の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000011.jpg)

【ページ内のテキスト情報】

Silicone-FreeThermalInterfaceMaterials６COOLPROVIDEＴＭ/CPSSBoth-sidetackytype／CPSSReleaselinerAcrylicthermalconductivelayerReleaselinerOne-sidetackytype／CPSS-FThin,permanentPETfilmAcrylicthermalconductivelayerReleaselinerFeaturesSuperlowhardness(ASKERC8)ThermalPad2W/m・Kandcompilable(ASKERC8)allowsforlesspressureontheheatsource,suchastheICorPCB.Allowsforlowerthermalresistanceonanunevensurfaces.Silicone-freematerial‒nosiloxaneoutgassing.■■■UltrasoftUltrasoft（Thevaluesbelowarenotguaranteed.）StandardーJISZ8807JISK7312ASTMD2240JISK6251JISK6251JISC2134ーーCPＳＳ-F2.01.4Darkgreen1.0／1.5／2.02.5／3.0／4.01.928330.288.91.0×10123.52.8600≦CTI(t=4.0mm)14.60.09V-2(t1.0-3.0mm)V-0(t4.0mm)-40～100200×500CPＳＳ2.01.4Darkgreen1.92833ーー1.0×1012ーー600≦CTI(t=4.0mm)ーー-40～100200×500UnitーーASKERCShore00MPa％Ω・cmkV/mmkV/mmー1MHz1MHz℃mmW/m・KmmーFlammabilityーUL943.0／4.0JISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)ーTesttypeColorTrackingresistanceLosstangentOperatingtempThermalConductivityHardnessThicknessSpecificGravityTensilestrengthVolumeResistivityBreakdownvoltageWithstandingvoltageDielectricconstantJISK6911compliantJISC2110-1compliantJISC2110-1compliantCompanystandardCompanystandardAvailablemax.dimension.※1ElongationrateCOOLPROVIDETM/CPVＴUltrathinthermalsheetissuitableforlimitedgapspacesuchasinmobileapplications.FeaturesThin,permanentPETfilmReleaselinerThicknessrangingfrom0.1mm~0.25mmat0.05mmpitchminimizesPCBload.Self-tackysheetprovideseasyworkabilitycomparedtogreaseapplication.Supercompliable(ASKERC28)materialminimizesthermalresistance.Silicone-free,nosiloxaneoutgassing.Suitableforthindesignsofperipheraldevicessuchassmartphones,tablets,etc.■■■■■Acrylicthermalconductivelayer(Thevaluesbelowarenotguaranteed.)StandardーJISZ8807JISK7312ASTMD2240JISK6251JISK6251UL94ーーCPVT-F2.01.4Green0.10／0.150.20／0.251.9434ー4.384.91.0×101311.15.06.690.08ー-20～100190×490UnitーーASKERCShore00MPa％Ω・cmkV/mmkV/mm1MHz1MHzー℃mmW/m・KmmーJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)TesttypeColorLosstangentFlammabilityOperatingtempThermalConductivityHardnessThicknessSpecificGravityTensilestrengthVolumeResistivityBreakdownvoltageWithstandingvoltageDielectricconstantJISK6911compliantJISC2110-1compliantJISC2110-1compliantCompanystandardCompanystandard※1)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.Availablemax.dimension.※1Elongationrate※1)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.Silicone-free

## Page 12
![Page 12の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000012.jpg)

【ページ内のテキスト情報】

7Silicone-freeCOOLPROVIDEＴＭ/CPLKThermal+EMCSilicone-FreeThermalInterfaceMaterials■ResonancePhenomenaThermalconductivesheetICThin,permanentPETfilmLow-dielectricthermalconductivelayerReleaselinerThedielectricconstantoftheTIMhasasignificanteffectonnoiseradiation.DualFunctionNoiseSuppressionThermalPadFeaturesResonancefrequencyisinfluencedbythedimensionsoftheheatsink,aswellasthepermittivitywithintheresonator.■CPLK’slowpermittivity14.6/1MHzhasasignificanteffectonnoisereduction.■Low-dielectricthermallyconductivesheethelpstoreducenoiseinGHzbands,whichoccursbyheatsink’sresonancephenomena.■Silicone-freegeneratesnosiloxanegasandoilbleeding.εHeatsink※2effCircuitboardCircuitboardgroundlayerTesttypeThermalConductivityColorThicknessUnit（Thevaluesbelowarenotguaranteed.)StandardCPLK-FJISR2616(Hot-wiremethod)W/m・KISO22007-2(HotDiscmethod)ーーｍｍSpecificGravityーJISZ88072.0HardnessASKERCJISK731230ShoreOOASTMD224060TensilestrengthMPaJISK62510.39Elongationrate%JISK62519.1VolumeResistivityΩ・cmJISK6911compliant1.0×1011BreakdownvoltagekV/mmJISC2110-1compliant6.6WithstandingvoltagekV/mmJISC2110-1compliant3.0Dielectricconstant1MHzCompanystandard5.40Losstangent1MHzCompanystandard0.003FlammabilityーUL94V-0equivalentOperatingtemp℃ー-40～125Availablemax.dimension※1ｍｍー200×500※1)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.ー2.01.4Purple1.0/1.5/2.0■EffectsofDielectric(measured)1.0GHz~1.2GHzMagneticfieldintensityinvicinityofheatsinkNothermalconductivesheetWiththermalconductivesheet※3WithCPLK-FHeatsinksurfaceHighCurrentdistributiononaheatsinksurfaceLow※2εeff=Equivalentrelativepermittivitybetweenaheatsinkandagroundlayerofacircuitboard※3Relativepermittivity：ε′=35

## Page 13
![Page 13の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000013.jpg)

【ページ内のテキスト情報】

Silicone-FreeThermalInterfaceMaterials8COOLPROVIDEＴＭ/EMPV4Thin,permanentPETfilmDualfunctionEMIabsorberandthermalpadReleaselinerFeaturesThermalInterfaceMaterialwithHighPermeability(µ'=13)■■■ExcellentEMIabsorberperformance(µ'=13@10MHz)andcompliablethermalmaterial(ASKERC40).Haveexcellentadhesion,performsheatconductionandMHz～GHzrangeelectromagneticwaveattenuationsimultaneously.Silicone-free,nosiloxaneoutgassing.（Thevaluesbelowarenotguaranteed.）※1)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.StandardーJISZ8807JISK7312ASTMD2240JISK6251JISK6251UL94ーーEMPV4-F1.51.3Black1.0／1.5／2.02.5／3.0／3.53.5540700.51161.0×10126.04.212.70.13V-0equivalent-40～110200×500UnitーーASKERCShore00MPa％Ω・cmkV/mmkV/mm1MHz1MHzー℃mmW/m・Kーー13JISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)TesttypeColorLosstangentFlammabilityOperatingtempHardnessPermeability(at10MHz)SpecificGravityThermalConductivityTensilestrengthVolumeResistivityBreakdownvoltageWithstandingvoltageDielectricconstantJISK6911compliantJISC2110-1compliantJISC2110-1compliantCompanystandardCompanystandardAvailablemax.dimension.※1ThicknessｍｍーElongationrateCOOLPROVIDEＴＭ/EMPV5FeaturesBroadbandEMIAbsorberandThermalPadforHigherFrequenciesThin,permanentPETfilmDualfunctionEMIabsorberandthermalpadReleaseliner■■■■■Suppressesnoisefrom500MHzto3GHz.Silicone-free,nosiloxaneoutgassing.Operatingtemperature:-40~+110CThermalconductivity:0.8W/m・KPermeability@10MHz:7（Thevaluesbelowarenotguaranteed.）※1)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.HardnessPermeability(at10MHz)TesttypeColorFlammabilityOperatingtempThicknessEMPV5-F0.8Black30601.0×10118.85.0V-0equivalent-40～110200×50071.0／1.5／2.02.5／3.0／3.5mmーUnitW/m・K―ASCERCShore00Ω・cmkV/mmkV/mmー℃mmStandardーJISK7312ASTMD2240UL94ーーーISO22007-2(HotDiscmethod)ーAvailablemax.dimension.※1WithstandingvoltageBreakdownvoltageVolumeResistivityJISK6911compliantJISC2110-1compliantJISC2110-1compliantThermalConductivityThermal+EMCThermal+EMCThermal+EMCThermal+EMCSilicone-free

## Page 14
![Page 14の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000014.jpg)

【ページ内のテキスト情報】

9Silicone-freeTHERMALDAMPER/CPAG高減衰HighdampingSilicone-FreeThermalInterfaceMaterialsWithadhesivetape／CPAG-TReleasepaperDouble-sidedadhesivetapeVibrationdampingthermalpadReleaselinerWithnoadhesivetape／CPAGReleaselinerVibrationdampingthermalpadThermalconductiveandvibrationdampingmaterial(lossfactorof0.9)Features■Dualfunctionthermalconductiveandvibrationdampingsheet.■Excellentvibrationcontrol.(lossfactor0.9)■Customprofilescanbeprovideduponrequest.■Silicone-free,nosiloxaneoutgassing.TesttypeThermalConductivityColorHardnessUnitW/m・KーStandardJISR2616（Hot-wiremethod）ーThicknessmmーVolumeResistivityASKERＣJISK7312DurometertypeAJISK6253Ω・cmJISK6911compliant（Thevaluesbelowarenotguaranteed.）CPAG-TCPAG0.80.8BlackBlack0.5／1.0／2.00.5／1.0／2.03.0／4.0／5.03.0／4.0／5.07070Ａ64Ａ645.54×10115.54×1011V-1equivalentFlammabilityーUL94ー(t2.0mm)V-0equivalent(t3.0-5.0mm)LossFactorー―0.90.9Operatingtemp℃ー-10～100-10～100Availablemax.dimension.※1mmー340×340350×350※２※1)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.※２)t=0.5:200×200Releaseliner

## Page 15
![Page 15の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000015.jpg)

【ページ内のテキスト情報】

10Silicone-BasedThermalPads10ReleaselinerThermalconductivesiliconelayerReleaselinerCOOLPROVIDEＴＭ/SPVSFeatures5W/m·KsiliconethermalpadforhighoperatingtemperatureapplicationsMinimalvolatile,low-molecularweightsiloxanegasforreducedPCBcontactfailure.Highperformance,highthermalconductivity.Operatingtemperaturerange-20～125℃■■■COOLPROVIDEＴＭ/SPVReleaselinerThermalconductivesiliconelayerReleaselinerFeatures3W/m·Ksiliconethermalpadforhighoperatingtemperatureapplications■■Soft,highthermalconductivesheet.Minimalvolatile,low-molecularweightsiloxanegasforreducedPCBcontactfailure.HighConductivityHighConductivityHighConductivityHighConductivity（Thevaluesbelowarenotguaranteed.）StandardーーJISZ8807JISK7312ASTMD2240JISK6251JISK6251UL94ーーSPVS5.03.4Green0.5／1.0／1.52.7570860.78163.0×10113.21.813.70.06V-0※2-20～125210×510UnitーｍｍーASCERCShore00MPa％Ω・cmkV/mmkV/mm1MHz1MHzー℃mmW/m・KISO22007-2(HotDiscmethod)JISR2616（Hot-wiremethod）（Thevaluesbelowarenotguaranteed.）StandardーーJISZ8807JISK7312ASTMD2240JISK6251JISK6251UL94ーーSPV3.02.3Green0.5／1.02.240690.49592.0×10110.690.335.10.07V-1(ｔ0.5ｍｍ)-20～125210×510UnitーｍｍーASCERCShore00MPa％Ω・cmkV/mmkV/mm1MHz1MHzー℃mmW/m・KISO22007-2(HotDiscmethod)JISR2616（Hot-wiremethod）TesttypeColorThicknessLosstangentFlammabilityOperatingtempHardnessThermalConductivitySpecificGravityTensilestrengthVolumeResistivityBreakdownvoltageWithstandingvoltageDielectricconstantJISK6911compliantJISC2110-1compliantJISC2110-1compliantCompanystandardCompanystandardTesttypeColorThicknessLosstangentFlammabilityOperatingtempHardnessThermalConductivitySpecificGravityTensilestrengthVolumeResistivityBreakdownvoltageWithstandingvoltageDielectricconstantJISK6911compliantJISC2110-1compliantJISC2110-1compliantCompanystandardCompanystandardAvailablemax.dimension.※1Availablemax.dimension.※1※1)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.※2)FlammabilityV-0isnotappliedtot=1.5.※1)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.SiliconeElongationrateElongationrate

## Page 16
![Page 16の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000016.jpg)

【ページ内のテキスト情報】

11CERACOLD/CECDPorousceramic-basedheatsinkforexcellentheatdissipationFeaturesCeramicHeatSinkL2■Largersurfaceareaofporousceramicheatsinkimprovesthermalemissivityandheatdissipationcomparedtostandardaluminumheatsinks.■Ceramicheatsinksareapproximately30%lighterthanaluminumheatsinks.■Unlikemetalheatsinks,ceramicheatsinksdonotemitelectromagneticradiation.PartNumberThickness:tL1（Unit：ｍｍ）L2CECD-1.5-020020T1.52020L1CECD-3.0-020020T3.02020CECD-3.0-040040T3.04040tCeramicDouble-sidedadhesivetapeTesttypeThermalConductivityColorUnitW/m・Kー（Thevaluesbelowarenotguaranteed.）StandardJISR2616（Hot-wiremethod）ーＣＥＣＤ11.5ＧｒｅｅｎSpecificGravityVolumeResistivityOperatingtempーΩ・cm℃JISZ8807JISK6911compliantー1.95≧108-40～125HeatdissipationefficiencyHeatconductivecharacteristicsComparisonofHeatSinkEfficiency100ThermocouplePCBSpecimenHeatsourcePowersourceTemperatureofheatsource（℃）5009090℃Noheatsink74℃Aluminumplate(t3mm)〈Testconditions〉Heatsource:□10mm(1.6W)Specimendimensions:□20mm(t3mm)68℃CECD(t3mm)EMInoiseissueswithmetalheatsinkStraycapacitanceoccursbetweentheICchip(noisesource)andtheheatsink(notgrounded),whichbecomesanantennaandemitsradiatednoise.CECDceramicheatsinkiselectricallyinsulating.CECDisnotaffectedbyelectrostaticcouplinganddoesnotfunctionasanantennatoradiatenoise.MetalICMetalheatsinkCeramicICCERACOLD

## Page 17
![Page 17の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000017.jpg)

【ページ内のテキスト情報】

HEATSPREADERSHEET/HSDThinandflexibleheatspreadingsheetforsuperiorthermalmanagement12Features■■■■Aluminumheatspreadermaterialwithexcellentthermalconductivity.(221W/m·K)Spreadsheatawayfromhotspotstocoolerareastopreventcomponentsfromoverheating.Optionalelectricallyinsulatingmylar(PET)layercanbeapplieduponrequest.Idealthermalsolutionforhotspotsonspaceconsciousapplicationssuchasmobiledevices,tablets,routers,videostreamingdevices,etc.HeatspreaderHSD-0.22HSD-0.30Aluminumfoil（100μm）Adhesivelayer(120μm)ReleasepaperAluminumfoil（200μm）Adhesivelayer(100μm)Releasepaper（Thevaluesbelowarenotguaranteed.）TesttypeUnitStandardHSD-0.22HSD-0.30SurfaceThermalConductivityW/m・KJISR2616（Hot-wiremethod）221(aluminum）Thicknessｍｍー0.220.30AdhesionN/25ｍｍJISZ０２３７：２００９>16>11FlammabilityーULーーOperatingtemp℃ー-20～100HeatDissipationEffectheatdistributionNoheatsinkHSD-0.22HSD-0.30TestSample①②①②PETfilm（30μm）Aluminumfoi（100μm）PETfilm（30μm）Aluminumfoi（200μm）③③Adhesivelayer（120μm）Adhesivelayer（100μm）TestingmethodHSDSeriesHeatDissipationEffectThermography908083.8ThermocouplePCBSpecimenHeatsourcePowersourceTemperatureofheatsource（℃）7060504030201059.659.30NoheatspreaderHSD-0.22HSD-0.30<Testconditions>Heatsource:□25mm(1.5W)Specimendimensions:□50mm

## Page 18
![Page 18の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000018.jpg)

【ページ内のテキスト情報】

TerminologiesLow-molecular-weightsiloxaneThenumberofdimethylsiloxanemoleculesinthesequenceisoftenreferredtoasD3(trimer),D4(tetramer),orD5(pentamer),andsoon.ThemoleculesuptoD20arecalled"lowmolecularweightcyclicsiloxane".Inparticular,thetotalvolumeofD3throughD10isusedasareferenceforthesilicone'squality.<Disadvantages>Thelow-molecular-weightsiloxaneishighlyvolatile.Itreadilyevaporatesatroomtemperature,whichresultsinthefollowingproblems.Dn：ＣＨ３Ｓi-0・Electriccontactfailure:Electricallyinsulativesilicaisdepositedonmetal,resultingincontactfailures.・Adverseeffectonopticalequipment:SiloxanegasadverselyaffectsopticalinstrumentsanddevicesＣＨ３nn＝3～10ThermalconductivityandthermalresistanceheatequationFourier'sequation:Q=λ×((ΔT・S)/d)Q:heatflow(W),λ:thermalconductivity(W/m·K),ΔT:temperaturedifference,S:crosssectionalareaofheattransferarea,d:distance<ThermalConductivity>Ameasureofamaterial'sabilitytotransferheat・Thevalueofthermalconductivitydoesnotchangeregardlessofmaterialsize.・Decreasingthethicknessofanobjectwilldecreaseitstemperaturedifference.λ(thermalconductivity)=(Q·d)/(ΔT·S)Where:d/ΔT=constant<ThermalResistance>Abilitytoresistflowofheat・Dependingondistanceoftheheatsource,area,andsurfaceconformity,theresistancevalueofthesamepadvaries.・Theresistancewillbedecreasedwhentheareaiswider;ahigherthermalconductivitymaterialisused;andthedistance/thicknesstoheatsourceisreduced.R1(thermalresistance):℃/W=d/(λ·S)Volumeresistivity(JISK6911compliant)Electricalresistanceisgenerallyusedasameasureofconductivity(easeofelectricconductance)ofanobjectormaterial.Resistanceofacertainmaterialpercubicunit(1cm3)isreferredasvolumeresistivity,whichisamaterialpropertyandismeasuredin[Ω·cm].Asshowninrightdiagram,thevolumeresistivityVoltageVＶiscalculatedbymeasuringavoltagedifferenceV(V)betweentwocontactsacrossthecrosssection(t·W)generatedbyaconstantcurrentI(A)flow.tLCurrentIWTensilelap-shearstrength(JISK6850:ISO4587andISO1995equivalent)Theshearstrengthtestingdeterminestheshearstrengthofadhesivesbyapplyingtensileforcetothespecimentopullitapartalongtheplaneofadhesionuntilthebreakdownoftheadhesivelayeroccurs.Itiscalculatedbydividingtheforcerequiredtoshearthespecimenbytheareaoftheshearedarea.

## Page 19
![Page 19の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000019.jpg)

【ページ内のテキスト情報】

MEMO

## Page 20
![Page 20の画像](https://img01.ebook5.net/techno-kitagawa/uQz3En/contents/image/book/medium/image-000020.jpg)

【ページ内のテキスト情報】

GlobalNetworkKITAGAWAINDUSTRIESCO.,LTD.695-1,Higashiorido,Mukui-cho,InazawaCity,AichiPrefecture492-8446,JapanTel:81-587-34-3561Fax:81-587-34-3109http://www.kitagawa-ind.comKITAGAWAINDUSTRIESAmerica,Inc.2860ZankerRoad,Suite#102SanJose,California95134,U.S.A.Tel:1-408-971-2055Fax:1-408-971-6033http://www.kgs-ind.comKITAGAWAGmbHBirkenwaldstr38,63179Obertshausen,GermanyTel:49-6104-60009-0Fax:49-6104-60009-40http://www.kitagawa.deKITAGAWAELECTRONICS(SINGAPORE)PTE.LTD.2BukitBatokStreet23#04-03BukitBatokConnectionSingapore659554Tel:65-6560-6511Fax:65-6560-6211http://www.kitagawa.com.sgKITAGAWAELECTRONICS(THAILAND)CO.,LTD.999/100Moo15,Bangsaothong,Bangsaothong,Samutprakarn10570,ThailandTel:66-2-182-5264Fax:66-2-182-5268SHANGHAIKITAGAWAINDUSTRIESCO.,LTD.9FNO.7BldgNo.773rdWestFuTeRoad,China(Shanghai)PilotFreeTradeZone,Shanghai200131,ChinaTel:86-21-5865-2766Fax:86-21-5064-4018KITAGAWATECHNOLOGY(SHENZHEN)CO.,LTD.Room09-10,11/F.,OfficeTower,ShunHingSquareDIWangCommercialCenter,5002ShenNanDongRoad,ShenzhenCity518002,ChinaTel:86-0755-2396-3200Fax:86-0755-2396-3490KITAGAWAINDUSTRlES(H.K.)LIMITEDUnitJ,15thFloor,EverGainCentre,43-57WangWoTsaiStreet,TsuenWan,NewTerritory,HongKongTel:852-2612-1161Fax:852-2612-1686http://www.kitagawa.com.hkKITAGAWAINDUSTRIES(TAIWAN)CO.,LTD.7F,No.75,HsinTaiWuRd.,Sec.1,HsiChihDist.,NewTaipeiCity,Taiwan,221Tel:886-2-2698-8833Fax:886-2-2698-3355http://www.kgtw.com.twhttps://www.kitagawa-ind.com/JUL.2024PrintedNo.2030100866