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ThermalManagementSolutions
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ProductLinesSilicone-FreeThermalInterfaceMaterialsalsp.4p.5p.6p.7p.8COOLPROVIDETM/CPVGCOOLPROVIDETM/CPSH,CPVHCOOLPROVIDEOVIDETM/CPVT,CPVPCOOLPROVIDETM/ＣＰLK,CPSSCOOLPROVIDETM/EMPV4，5p.9COOLPROVIDETM/CPAGFirstSolutionProposerSilicone-BasedSpecialThermalInterfaceMaterialsp.10p.11p.12p.13COOLPROVIDETM/SPVS,SPVCERACOLD/CECDGRAPHITEHYBRIDSHEET/GHS-25HEATSPREADERSHEET/HSDIconsThermal+EMCDualFunctionThermalandEMCEMISuppressionandThermalPadSolidPhaseChangeGelPhase-ChangeUponapplicationhigh-viscositygel-likematerialworksasagap-fillerHighConductivityHighThermalConductivity(3W/m·Korhigher)*HighheatdissipationfromICsHighdampingDualFunctionVibrationDamperandThermalSuppressvibrationfrequencyandtransferheat*HotwiremethodSofttypeFordevicescontainingmodulesaffectedbypressureandcompressionUltraSoftUltraSoft(ASKERC3orless)FeaturesExcellentconformabilitytounevensurfacesHighflexibilityandexcellentconformabilityminimizethermalinterfaceresistance.SuperSoftSuperSoft（ASKERC3.1tolessthan20）SofttypeLowloadExceptforsofttypesReducescompressionload(stress)onsensitivecomponents;preventsunintendedbowingordamage
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ProductSpotlightCOOLPROVIDE™/CPVGHighConductivityP.4Dispense-friendly,no-drip,single-liquidthermalputtyFeatures■UsefultofillgapsbetweenheatspreadersandICsofvariousheights.CPVG-30：GAP１ｍｍorlessCPVG-50：GAP2ｍｍorless■PuttyTIMappliesverylowforceaftercompression.(10%orlessascomparedtothermalpads)■Becausethepre-crosslinkedstateprovidesstructuralstability,nocuringprocess(suchasheatingorUV)isrequiredandwillnotdripimmediatelyafterapplication.■Appliedusingamanualcaulkinggunoranautomateddispenser.■Silicone-freeTIMgeneratesnosiloxanegasandhaslessoilbleeding.COOLPROVIDE™/CPVP-30HighConductivitySuperSoftP.62-layerputty-likethermalpadwithexcellentstressrelief■■■■FeaturesLowcompressionforceandexcellentstressrelaxation.Supercompliable(ASKERC0)materiallayeredbetweenthinpermanentPETfilmandlighttackylayerforeasyhandling.Operatingtemperature:-40~125℃Silicone-freeTIMgeneratesnosiloxanegasandhaslessoilbleeding.GRAPHITEHYBRIDSHEET/GHS-25P.P12.8Stackedlayersworktogethertopreventhotspotsandreturnedheattothedevice.■■■■FeaturesIdealforattachingtotheinsideofplasticcaseofelectronicdevices.Lowthermalconductivitylayerreducesspeedofheattransfertographitelayer,preventshotspotsfromoccurring,andimpedesheatreflectionbacktotheheatsource.Onesideheat-resistantadhesivetape.Additionoflowheatreflectionlayer(BlackPETfilm+Lowthermalconductivitylater)helpstoreducethetemperatureofheatsource.
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SafetyGuidelinesPleasereviewpriortousingourproducts.1.Thecontentsorproductsdescribedinthiscatalogmaychangewithoutnoticeduetoproductimprovementsandspecificationupdates.2.Allstatements,specifications,properties,technical.information,andrecommendationshereinarebasedontests;however,theaccuracyandcompletenessofthevaluesarenotguaranteed.3.Beforeexportinganyproductfeaturedinthiscatalog,ensurecompliancewiththe"ForeignExchangeandForeignTradeLaw."Ifcargofallsunderthisregulation,anappropriateexportlicenseisnecessary.Additionally,beawarethatcertaincountriesandregionshaverestrictionsonthesaleoftheseproducts.4.KGSassumesnoresponsibilityforanyissuesrelatedtoourintellectualpropertyrightsorthird-partyrightsthatariseaftertheuseofanyproductlistedinthiscatalog.Furthermore,KGSdoesnotauthorizethelicensingoftheserights.5.Thecontentofthiscatalogappliessolelytoproductspurchaseddirectlyfromusorthroughauthorizedagencies.Ifnoinformationregardingtheapplicableconditionsisprovided,oriftheproductswerepurchasedfromathirdparty,theconditionsoutlinedinthecatalogdonotapply.6.Productsinthiscatalogmaynotbeavailableforsaledependingoncountryorregion.7.Productslistedinthiscatalogaredesignedandtestedforgeneral-purposeapplicationscommonlyfoundinvariouselectronicdevicesandequipment,suchasAVsystems,officeequipment,computerperipherals,communicationdevices,homeappliances,industrialrobots,entertainmentsystems,personal-usedevices,measurement/testunits,andsimilarapplications.Theyareintendedforuseundernormaloperatingconditionsinthesegeneralelectronicdevicesandequipment.Thiscatalogdoesnotguaranteetheproduct'sperformanceorquality,particularlyiftheproductisintendedforuseinhigh-safetyandhigh-reliabilityorotherveryuniqueapplications,orinsituationswheredevicefailure,malfunction,ormisusecouldposerisksorharmtohumanlifeandhealth,causepropertydamage,orhavesignificantsocialimpact.Pleaseconsultusbeforeusingourproductsinthesecases,especiallyifyourrequirementsexceedtheproduct'snormalperformancerangeandconditionsspecifiedinthecatalog,orifyouhavespecificapplicationrequirements.①aerospaceequipment,②transportationequipment(automobiles,trains,ships,andsimilarvehicles),③nuclearpower-relatedequipment,④medicalequipment,⑤militaryequipment,⑥underwater/submarineequipment,⑦powergenerationcontrolequipment,⑧publicinformationprocessingequipment,⑨transportationcontrolequipment,⑩electricheatingequipment,combustionequipment,⑪disasterprevention,crimepreventionequipment,⑫varioussafetydevices,⑬otherusagedeemedtobeuniqueapplications.Whiledesigningtheequipmenttousetheproductinthiscatalog,pleasesecureaprotectionorabackupinaccordancewiththeintendeduseofthedevice.8.Whilewehaveimplementedcomprehensivemeasurestoenhancethesafety,quality,andreliabilityofourproduct,improperusemaypotentiallyresultinpersonalinjuries,firehazards,orsocietallosses.Contactusforguidanceonthecorrectuseofourproducts.Unauthorizedreproductionorduplicationofthecontentsofthiscatalogisstrictlyprohibited.[HandlingProcedures]●Duringinstallation,avoidcontactwiththeheatingelementtopreventanyburnsrisks.●Ensurethesurfaceisfreeofdirt,dust,oil,ormoisturebeforeinstalling.●Keepprotectivereleaselinerinplaceuntilusetopreventcontaminationfromdebrisanddust.●Productthicknessindicatedinthecatalogdoesnotincludetheprotectivereleaseliner.●StoreproductsatroomtemperatureinalowhumidityenvironmentandavoiddirectsunlightorUVrays.●Phase-changegelsmustbestoredbelow35℃(Recommendedtemperatureis25℃).●Duetotheinherenttackinessofourproducts,removalafterheatingorcompressingmaybechallenging.
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ApplicationsChassisPCB基板TIMusedbetweenheatsourceandheatsinkHeatsinkヒートシンクHeatsourceIC発熱ICHeatsourceICPCBTIMunderneathPCBbetweenheatsourceandmetalchassisMetalboardHeatsourceICPCBTIMusedbetweenChassisheatsourceandmetalchassisPCBHeatsourceICTIMusedbetweenheatsourceandmetalboardHeatdissipationsheet筐体ChassisHeatsourceIC熱拡散シートPCBHeatdissipationsheetHeat発熱ICsourceICMetalboardPCB基板HeatspreaderusedformodulewheretemperaturedifferenceisnotpermittedHeatspreaderusedforchassiswhereheatremainsSecondaryprocessingCutting●Round,square,specialshape,kiss-cutting,etc.●Customizedcuttingformulti-layeredproducts●SecondaryprocessforeasyassemblyWecanoffermultipleTIMpadspre-positionedonacarrierfilm.ThisallowsforthesimultaneousassemblyofmultipleTIMpads,eventhosevaryinginsize,thickness,ortype,resultinginasignificantimprovementinoperationalefficiency.＜Diagram＞Holes＜ApplicationExamples＞PETfilmPETfilmThermalpadHeat-generatingICPinPCBThermalpadByaligningtheholesonthePETfilmandpinpositionsonthePCB,theTIMscanbeappliedtotheICsintheircorrectalignment.PCBOtherprocessing(Variousotherprocessesarepossible.Pleasefeelfreetocontactoursales.)
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1Silicone-FreeThermalInterfaceMaterialsPropertiesofThermalConductiveMaterials(Silicone-Free)JISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)CPVT-F2.01.4Ｇｒｅｅｎ0.10／0.150.20／0.251.9434ー4.384.91.0×101311.15.06.690.08ー-20～100１９０×４９０JISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)CPAG-Tー0.5orhigherBlack0.5／1.0／2.03.0／4.0／5.01.57orhigher70DurometertypeＡ64*5ーー5.54×1011ーーーーー-10～100335×335*6CPAG0.80.72Black0.5／1.0／2.03.0／4.0／5.01.6770DurometertypeＡ64*5ーー5.54×1011ーーーーーV-1equivalent(t2.0mm)V-0equivalent(t3.0-5.0mm)-10～100335×335*6JISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)CPSH-F5.03.65Lightgreen0.5／1.0／1.5／2.02.5／3.0／3.5／4.02.8932*3640.37101.0×10112.21.418.20.01V-0*4-40～125200×500CPSH5.03.65Lightgreen1.0／1.5／2.02.5／3.0／3.5／4.02.8932640.21201.0×10112.01.218.80.01Ｖ-0equivalent-40～125200×500CPVH-F3.02.1Brown0.5／1.0／1.5／2.02.5／3.0／3.5／4.02.3315470.254.01.0×1011３．１2.118.20.08V-0-40～125200×500CPVH3.02.1Brown2.3315470.15741.0×1011２．９1.919.60.08V-0-40～125200×5002.0／3.0／4.0StandardーーJISZ8807JISK7312ASTMD2240JISK6251JISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliantJISC2134CompanystandardCompanystandardUL94ーーUnitW/m・KーｍｍーASKERCShore00MPa％Ω・cmkV/mmkV/mmーーーー℃ｍｍCPVP-F2.01.4Darkgreen／White1.0／１．５／2.0３.0／4.0／5.0／6.0１．９２0(Ultrasoftlayer)ー0.317.51.0×10119.1811.30.04V-0-40～125200×5１５CPVP-30-Fー２．５orhigher(Supersoftlayer：３．０)Green／White2.627(Supersoftlayer)18(Supersoftlayer)0.387.91.0×10114.43.511.90.01V-0-40～125200×5１５1.0／2.0／3.0／4.0CPLK-F2.01.4Purple2.030600.399.11.0×10116.63.05.400.003V-0equivalent-40～125200×5001.0／1.5／2.0EMPV4-F1.51.3Black1.0／1.5／2.02.5／3.0／3.53.5540700.51161.0×10126.04.212.70.13V-0equivalent-40～110200×500EMPV5-Fー0.8Black1.0／1.5／2.02.5／3.0／3.52.693060ーー1.0×10118.85.07.40.0８V-0equivalent-40～110200×500Dielectricconstant1MHzLosstangent1MHzDielectricconstant1MHzLosstangent1MHzDielectricconstant1MHzLosstangent1MHzTesttypeThermalConductivityColorThicknessSpecificGravityHardness*1TensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageTrackingresistanceFlammabilityOperatingtempAvailablemax.dimension*2TesttypeThermalConductivityColorThicknessSpecificGravityHardness*1TensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageTrackingresistanceFlammabilityOperatingtempAvailablemax.dimension*2UnitW/m・KーｍｍーASKERCShore00MPa％Ω・cmkV/mmkV/mmーーーー℃ｍｍStandardーーJISZ8807JISK7312ASTMD2240JISK6251JISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliantJISC2134CompanystandardCompanystandardUL94ーーTesttypeThermalConductivityColorThicknessSpecificGravityHardness*1TensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageTrackingresistanceOperatingtempAvailablemax.dimension*2FlammabilityUnitW/m・KーｍｍーASKERCShore00MPa％Ω・cmkV/mmkV/mmーーー℃ｍｍStandardーーJISZ8807JISK7312ASTMD2240JISK6251JISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliantJISC2134CompanystandardCompanystandardーーーUL94CPＳＳ-F2.01.4Darkgreen1.0／1.5／2.02.5／3.0／4.01.928330.288.91.0×10123.52.814.60.09V-2(t1.0-3.0mm)V-0(t4.0mm)-40～100200×500CPＳＳ2.01.4Darkgreen1.92833ーー1.0×1012ーーPLC:0(600Vorhigher)(t=3.0mm)ーー-40～100200×5003.0／4.0ーー（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）PLC:0(600Vorhigher)(t=3.0mm)PLC:0(600Vorhigher)(t=4.0mm)PLC:0(600Vorhigher)(t=3.0mm)PLC:2(350V)(t=3.5mm)PLC:2(350V)(t=3.0mm)PLC:0(600Vorhigher)(t=3.0mm)PLC:0(600Vorhigher)(t=3.0mm)PLC:0(600Vorhigher)(t=3.0mm)PLC:0(600Vorhigher)(t=3.0mm)PLC:0(600Vorhigher)(t=3.0mm)PLC:0(600Vorhigher)(t=3.0mm)(Softlayer:0.72)(Softlayer：1.67)
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2PropertiesofThermalConductiveMaterials(Silicone-Based)TesttypeThermalConductivityColorThicknessSpecificGravityHardness*1TensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageTrackingresistanceDielectricconstant1MHzLosstangent1MHzFlammabilityOperatingtempAvailablemax.dimension*2（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）UnitW/m・KーStandardJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)ーSPVS5.03.4GreenSPV3.02.3GreenｍｍーASKERCShore00MPa％Ω・cmkV/mmkV/mmーーーー℃ｍｍーJISZ8807JISK7312ASTMD2240JISK6251JISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliantJISC2134CompanystandardCompanystandardUL94ーー0.5／1.0／1.52.7570860.78163.0×10113.21.8PLC:0(600Vorhigher)(t=4.0mm)13.70.06V-0*7-20～125200×5000.5／1.02.240690.49592.0×10110.690.3PLC:0(600Vorhigher)(t=3．０mm)35.10.07V-1(ｔ0.5ｍｍ)-20～125215×500Silicone-BasedThermalInterfaceMaterialsComparisonofProductSeries●Silicone-free●Silicone-basedHardnessＡＳＫＥＲC010203040506070Softer●CPVP(p.6)●CPSS●ＣＰＳＳ(p.7)●ＣＰＶG-30(p.4)●ＣＰＶG-50(p.4)●CPVP-30(p.6)●CPVH●ＣＰＶH(p.5)●EMPV5●CPLK(p.7)(p.8)●CPVT(p.6)●CPSH(p.5)●EMPV4●SPV(p.10)(p.8)●CPAG(p.9)●SPVS(p.10)8090Higherthermal高熱伝導conductivity1000１23ThermalConductivity(W/m・Ｋ)45HotDiscmethod*1：MeasuredUltrasoft/Supersoft/Softlayer,minimum10mmstacked.*2：Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.*３：0.5F：ASKERC55*４：CPSH-F0.5F:V-0equivalent.*５：JISK6253compliant*６：t=0.5:200×200*７：t=1.5：V-0equivalent
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3Thermalresistancemeasurement(InaccordancewithASTMD5471)■Thermallyconductivepad■Dual-functionthermal+EMCpadSilicone-FreeThermalInterfaceMaterialsThermalResistance[K/W]2.5●CPSS-F●CPVP-F●CPVH-F2.0●CPVP-30-F1.79●CPSH-F1.711.51.311.251.270.971.01.040.770.730.800.680.570.50.510.520.290.00123Gap[mm](Unit:K/W)Gap(mm)PartNO.CPSS-FCPVP-FCPVH-FCPVP-30-FCPSH-FEMPV5-FEMPV4-FCPLK-F0.80.770.730.570.510.290.940.800.711.61.311.270.970.800.521.631.281.262.41.791.711.251.040.682.171.68ーThermalResistance[K/W]2.52.01.51.00.5●EMPV5-F●EMPV4-F●CPLK-F0.940.800.711.631.281.262.171.680.00123Gap[mm]●In－housethermalresistancemeasurementequipment(InaccordancewithASTMD5471)【Testsetup】Measurementstakenusingourin-housethermalresistancemeasurementsystem(seephoto)SampleSize:25mm×25mmThickness:Datarepresentedisafter20%compression(recommendedrate)of1mm,2mm,and3mmthickpads*Nooptionfor3mmthickCPLK.Therefore,2.4mmgapdataisN/A.HeaterOutput:20WFeatures■ASTMD5470testmethodincludescontactthermalresistancebetweentheTIMandthemeasurementsurface.Therefore,itcanevaluateapparenteffectivethermalconductivitynearactualuseconditions.TestMethod１．Placethethermalpadbetweentheheatingandcoolingcopperblocks.２．Applyaconstantheatflowfromthebottomtothetop.Measurethetemperaturedifferencebetweenbothsidesofthesample.Measuretharmalpadthickness.３．Calculatethethermalresistanceandapparentthermalconductivityusingtheabovemeasurementsandthesampledimensions.＜Diagram＞CoolingFanHeatSinkDistanceHeatflowrate(Q)SampleThermocouple(Measuretheuppersamplesurface)ΔTHeaterThermocouple(Measurethebottomsamplesurface)HeatinsulatingmaterialTemperatureT1T２ThermalResistanceR＝ΔT/QQ：Heatquantity(Amountofheatappliedbytheheater)
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Silicone-free4COOLPROVIDE™/CPVGHighConductivityDispense-friendly,no-drip,single-liquidthermalputtyFeatures■UsefultofillgapsbetweenheatspreadersandICsofvariousheights.CPVG-30：GAP１ｍｍorlessCPVG-50：GAP2ｍｍorless■PuttyTIMappliesverylowforceaftercompression.(10%orlessascomparedtothermalpads)■Becausethepre-crosslinkedstateprovidesstructuralstability,nocuringprocess(suchasheatingorUV)isrequiredandwillnotdripimmediatelyafterapplication.■Appliedusingamanualcaulkinggunoranautomateddispenser.■Silicone-freeTIMgeneratesnosiloxanegasandhaslessoilbleeding.■Driptest(Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.)TesttypeUnitStandardCPVG-30-CCPVG-50-PProductsCoatingthicknessResultsCompetitor'sgrease1.0mmCPVG-301.0mmCPVG-501.0mmThermalConductivityt1.0mmThermalt0.3mmresistance＊1t0.1mmColorSpecificGravity0.5[1/s]W/m・K℃/WーーISO22007-2（HotDiscmethod）ASTMD5470ーJISZ88073.00.330.080.01White2.933005.00.190.05ーWhite3.2ーDripobservedNodripNodrip【Heatcycletestconditions/High-temperaturetestconditions】Viscosity1.0[1/s]Pa・sASTMD1824compliant2500ー・Temperature：125℃・Time:1000h・TestMethod:Testsamplesandwichedbetweenaluminumandglassplates10rpmRecommendedThicknessVolumeResistivityBreakdownvoltageーmmΩ・cmkV/mmーーJISK6911compliantJISK6911compliant6000.1～1.01.0×109810000.3～2.01.0×1093DielectricconstantLosstangent1MHz1MHzーーCompanystandardCompanystandard9.250.0613.20.07ShelfLife(25℃)FlammabilityOperatingtempーー℃CompanystandardUL94ー6monthsafterdeliveryV-0equivalent-40～1256monthsafterdeliveryV-0equivalent-40～130SupplyformatーーCartridge330ml20LPail（Netcontent：17kg）Silicone-FreeThermalInterfaceMaterials＊1)Samplesize：□25mm■BenefitsofCPVG(PuttyTIM)①SinglesheetTIM②MultipleTIMs③CPVGputty■CompressionforcecomparisonwithCPVG(Putty)andthermalpads����������������1009080Issue:cracksduetohighcompressionWorkability:componentsICLoadIssue:highlaborcost①②③〇××③CPVGthermalputtyapplication〇△〇EasypositioningofheatdissipationcomponentsSpreadstofillthegapuponcompression,reducingtheloadontheIC③CPVGthermalputtyinstallationCompressionforce(N）70605040302019.458.9109.2＊Wecanhelpverifiydispensingandapplicationconditions.0CPVH(2.1W/m・K)3.5CPVG-30(3.0W/m・K)CPSH(3.65W/m・K)CPVG-50(5.0W/m・K)＜Testconditions＞・Sampledimensions：□10mm×10mm（t2mm）・Compressionrate：20％compressed(t2mm⇒t1.6mm)＊Maximumcompressionforceat20%compressionislisted.＊Thethermalconductivityofeachproductismeasuredbythehotdiskmethod.
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5Silicone-freeCOOLPROVIDETM/CPSHHighConductivity5W/m・KSilicone-FreeThermalconductivesheetSilicone-FreeThermalInterfaceMaterialsOne-sidetackytype／CPSH-FAcrylicthermalconductivelayer（Softlayer）Thin,permanentPETfilmReleaselinerBoth-sidetackytype／ＣＰＳＨAcrylicthermalconductivelayer（Softlayer）ReleaselinerReleaselinerFeatures■Highperformance(5W/m・K)andsoft(ASKERC32)silicone-freeThermalconductivesheet.■Crowdsoutairbubblestoreducethermalresistance.■Silicone-freeTIMgeneratesnosiloxanegasandhaslessoilbleeding.（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）TesttypeThermalConductivityUnitW/m・KStandardJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)CPSH-F5.03.65CPSH5.03.65ColorThicknessーmmーーLightgreen0.5／1.0／1.5／2.0Lightgreen1.0／1.5／2.0SpecificGravityHardness＊1ーASKERCJISZ8807JISK73122.5／3.0／3.5／4.02.8932＊32.5／3.0／3.5／4.02.8932TensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageTrackingresistanceDielectricconstant1MHzShore00MPa％Ω・cmkV/mmkV/mmーーASTMD2240JISK6251JISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliantJISC2134Companystandard640.37101.0×10112.21.4PLC:0(600Vorhigher)(t=3.0mm)18.2640.21201.0×10112.01.2PLC:0(600Vorhigher)(t=3.0mm)18.8Losstangent1MHzーCompanystandard0.010.01FlammabilityOperatingtempAvailablemax.dimension＊2ー℃mmUL94ーーV-0＊4-40～125200×500Ｖ-0equivalent-40～125200×500＊1)MeasuredUltrasoft/Supersoft/Softlayer,minimum10mmstacked＊2)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.＊3)0.5Ｆ：ASKERC55＊4)0.5F：V-0equivalentCOOLPROVIDETM/CPVHHighConductivitySuperSoft3W/m・Ksoft(ASKERC15)thermalpadFeatures■Softandcompilable(ASKERC15)siliconefreethermalpadhelpstocrowdoutairbubblesandreducethermalresistance.■Softandcompilable(ASKERC15)siliconefreethermalpadhelpsto■crowdoutairbubblesandreducethermalresistance.■Silicone-freeTIMgeneratesnosiloxanegasandhaslessoilbleeding.One-sidetackytype／CPVH-FAcrylicthermalconductivelayer（Supersoftlayer）Thin,permanentPETfilmReleaselinerBoth-sidetackytype／CPVHAcrylicthermalconductivelayer（Supersoftlayer）ReleaselinerReleaseliner（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）TesttypeThermalConductivityUnitW/m・KStandardJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)CPVH-F3.02.1CPVH3.02.1ColorThicknessーmmーーBrown0.5／1.0／1.5／2.0Brown2.0／3.0／4.0SpecificGravityHardness＊１ーASKERCJISZ8807JISK73122.5／3.0／3.5／4.02.33152.3315TensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageTrackingresistanceDielectricconstant1MHzShore00MPa％Ω・cmkV/mmkV/mmーーASTMD2240JISK6251JISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliantJISC2134Companystandard470.254.01.0×1011３．１2.1PLC:0(600Vorhigher)(t=3.0mm)18.2470.15741.0×1011２．９1.9PLC:0(600Vorhigher)(t=3.0mm)19.6Losstangent1MHzーCompanystandard0.080.08FlammabilityOperatingtempAvailablemax.dimension＊2ー℃mmUL94ーーV-0-40～125200×500V-0-40～125200×500＊1)MeasuredUltrasoft/Supersoft/Softlayer,minimum10mmstacked＊2)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.
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Silicone-free6COOLPROVIDETM/CPVＴAcrylicthermalconductivelayer（Softlayer）Thin,permanentPETfilmReleaselinerCOOLPROVIDEＴＭ/CPVPUltrathinthermalconductivesheetissuitableforlimitedgapspacesuchasinmobileapplications.Features■Thicknessrangingfrom0.1mm~0.25mmat0.05mmpitchminimizesPCBload.■Self-tackysheetprovideseasyworkabilitycomparedtogreaseapplication.■Supercompliable(ASKERC34)materialminimizesthermalresistance.■Silicone-freeTIMgeneratesnosiloxanegasandhaslessoilbleeding.TesttypeThermalConductivityColorThicknessSpecificGravityHardness＊1TensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageTrackingresistanceDielectricconstant1MHz（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）UnitW/m・KStandardJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)CPVT-F2.01.4ーmmーASKERCShore00MPaーーJISZ8807JISK7312ASTMD2240JISK6251Green0.10／0.15／0.20／0.251.9434ー4.38％Ω・cmkV/mmkV/mmーーJISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliantJISC2134Companystandard4.91.0×101311.15.0PLC:0(600Vorhigher)(t=3.0mm)6.69Losstangent1MHzーCompanystandard0.08FlammabilityーUL94ーOperatingtemp℃ー-20～100Availablemax.dimension＊2mmー１９０×４９０＊1)MeasuredUltrasoft/Supersoft/Softlayer,minimum10mmstacked.＊2)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.HighConductivitySuperSoftUltraSoftSilicone-FreeThermalInterfaceMaterials2-layerputty-likethermalpadwithexcellentstressrelief■■■■Features＊CPVP:2.0W/ｍ・KLowcompressionforceandexcellentstressrelaxation.Supercompliable(ASKERC0)materiallayeredbetweenthinpermanentPETfilmandlighttackylayerforeasyhandling.Operatingtemperature:-40~125℃Silicone-freeTIMgeneratesnosiloxanegasandhaslessoilbleeding.CPVP-FUltrasoftlayerEasypeelinglayerCPVP-30-FSupersoftlayerEasypeelinglayerThin,permanentPETfilmAcrylicthermalconductivelayerReleaselinerThin,permanentPETfilmAcrylicthermalconductivelayerReleaseliner（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）TesttypeThermalConductivityColorUnitW/m・KーStandardJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)ーCPVP-F2.01.4Darkgreen／White1.0／１．５／2.0CPVP-30-Fー２．５orhigher（Supersoftlayer：3.0）Green／WhiteThicknessｍｍー1.0／2.0／3.0／4.03.0／4.0／5.0／6.0SpecificGravityHardness＊1ーASKERCShore00JISZ8807JISK7312ASTMD2240１．９２0(Ultrasoftlayer)ー2.627（Supersoftlayer）18（Supersoftlayer）TensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageMPa％Ω・cmkV/mmkV/mmJISK6251JISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliant０．３１７．５1.0×1011９．１８0.387.91.0×10114.43.5TrackingresistanceーJISC2134PLC:0(600Vorhigher)PLC:0(600Vorhigher)(t=3.0mm)(t=4.0mm)Dielectricconstant1MHzーCompanystandard１１．３11.9Losstangent1MHzーCompanystandard０．０４0.01FlammabilityOperatingtempAvailablemax.dimension＊2ー℃ｍｍUL94ーーV-0-40～125200×5１５V-0-40～125200×5１５※1)MeasuredUltrasoft/Supersoft/Softlayer,minimum10mmstacked.＊2)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.
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7Silicone-freeCOOLPROVIDEＴＭ/CPLKThermal+EMCDualFunctionNoiseSuppressionｔhermalconductivesheetSilicone-FreeThermalInterfaceMaterialsAcrylicdual-functionsoftlayer(Low-permittivity+TIM)Thin,permanentPETfilmReleaselinerFeatures■CPLK’slowpermittivity5.4/1MHzhasasignificanteffectonnoisereduction.■Low-dielectricｔhermalconductivesheethelpstoreducenoiseinGHzbands,whichoccursbyheatsink’sresonancephenomena.■Silicone-freegeneratesnosiloxanegasandoilbleeding.（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）TesttypeThermalConductivityUnitW/m・KStandardJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)CPLK-F2.01.4ColorThicknessSpecificGravityHardness＊1TensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageTrackingresistanceDielectricconstant1MHzーｍｍーASKERCShore00MPa％Ω・cmkV/mmkV/mmーーーーJISZ8807JISK7312ASTMD2240JISK6251JISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliantJISC2134CompanystandardPurple1.0／1.5／2.02.030600.399.11.0×10116.63.0PLC:0(600Vorhigher)(t=3.0mm)5.40Losstangent1MHzーCompanystandard0.003FlammabilityOperatingtempAvailablemax.dimension＊2ー℃ｍｍUL94ーーV-0equivalent-40～125200×500＊1)MeasuredUltrasoft/Supersoft/Softlayer,minimum10mmstacked.＊2)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.COOLPROVIDEＴＭ/CPSSSuperSoftSuperlowhardness(ASKERC8)ThermalPadFeatures■2W/m・Kandcompilable(ASKERC8)allowsforlesspressureontheheatsource,suchastheICorPCB.■Allowsforlowerthermalresistanceonanunevensurfaces.■Silicone-freegeneratesnosiloxanegasandoilbleeding.One-sidetackytype／CPSS-FAcrylicthermalconductivelayer（Supersoftlayer）Thin,permanentPETfilmReleaselinerBoth-sidetackytype／CPSSAcrylicthermalconductivelayer（Supersoftlayer）ReleaselinerReleaseliner（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）TesttypeThermalConductivityColorThicknessUnitW/m・KーmmStandardJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)ーーCPＳＳ-F2.01.4Darkgreen1.0／1.5／2.0CPＳＳ2.01.4Darkgreen3.0／4.0SpecificGravityHardness＊1ーASKERCJISZ8807JISK73122.5／3.0／4.01.9281.928TensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageTrackingresistanceDielectricconstant1MHzShore00MPa％Ω・cmkV/mmkV/mmーーASTMD2240JISK6251JISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliantJISC2134Companystandard330.288.91.0×10123.52.8PLC:0(600Vorhigher)(t=３.0mm)14.633ーー1.0×1012ーーPLC:0(600Vorhigher)(t=3.0mm)ーLosstangent1MHzーCompanystandard0.09V-2(t1.0-3.0mm)ーFlammabilityーUL94V-0(t4.0mm)ーOperatingtempAvailablemax.dimension＊2℃mmーー-40～100200×500-40～100200×500＊1)MeasuredUltrasoft/Supersoft/Softlayer,minimum10mmstacked.＊2)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.
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8Silicone-FreeThermalInterfaceMaterialsCOOLPROVIDEＴＭ/EMPV4Dual-functionhighpermeabilityEMIabsorberthermalconductivesheetFeaturesAchievedbothlowhardness(AskerC40)andhighpermeability(μ'=13)inasilicone-freesheet.Haveexcellentadhesion,performsheatconductionandMHz～GHzrangeelectromagneticwaveattenuationsimultaneously.Silicone-freegeneratesnosiloxanegasandoilbleeding.■■■（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）W/m・KTesttypeColorSpecificGravityTensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageTrackingresistanceFlammabilityOperatingtempAvailablemax.dimension＊2ThermalConductivityHardness＊1ーJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)UnitーーASKERCShore00MPa％Ω・cmkV/mmkV/mmーーーー℃mmStandardーJISZ8807JISK7312ASTMD2240JISK6251JISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliantJISC2134CompanystandardCompanystandardUL94ーーーEMPV4-F1.51.3Black3.5540700.51161.0×10126.04.2PLC:2(350V)(t=3.5mm)12.70.13V-0equivalent13-40～110200×500Thicknessｍｍー1.0／1.5／2.02.5／3.0／3.5＊1)MeasuredUltrasoft/Supersoft/Softlayer,minimum10mmstacked.＊2)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.Dielectricconstant1MHzLosstangent1MHzPerme-ability10MHzThin,permanentPETfilmReleaselinerAcrylicdual-functionsoftlayer(EMIAbsorber+TIM)Thin,permanentPETfilmReleaselinerCOOLPROVIDEＴＭ/EMPV5FeaturesDual-functionbroadbandEMIabsorberthermalconductivesheetSuppressesnoisefrom500MHzto3GHz.Silicone-freegeneratesnosiloxanegasandoilbleeding.Operatingtemperature:-40~+110CThermalconductivity:0.8W/m・KPermeability@10MHz:7■■■■■Acrylicdual-functionsoftlayer(EMIAbsorber+TIM)（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）W/m・KTesttypeColorSpecificGravityTensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageTrackingresistanceFlammabilityOperatingtempAvailablemax.dimension＊2ThermalConductivityHardness＊1ーJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)UnitーーASKERCShore00MPa％Ω・cmkV/mmkV/mmーーーー℃mmStandardーJISZ8807JISK7312ASTMD2240JISK6251JISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliantJISC2134CompanystandardCompanystandardUL94ーーーEMPV5-Fー０．８Black２．６９３０６０ーー1.0×1011８．８５．０PLC:2(350V)(t=3.0mm)７．４０．０８V-0equivalent7-40～110200×500Thicknessｍｍー1.0／1.5／2.02.5／3.0／3.5＊1)MeasuredUltrasoft/Supersoft/Softlayer,minimum10mmstacked.＊2)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.Dielectricconstant1MHzLosstangent1MHz10MHzSilicone-freePerme-abilityThermal+EMCThermal+EMCThermal+EMCThermal+EMC
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9Silicone-freeTHERMALDAMPER/CPAGHighdampingSilicone-FreeThermalInterfaceMaterialsWithadhesivetape／CPAG-TAcrylicdual-functionsoftlayer(Vibrationdamping+TIM)ReleasepaperDouble-sidedadhesivetape（Thickness：０．１６mm)ReleaselinerWithnoadhesivetape／CPAGAcrylicdual-functionsoftlayer(Vibrationdamping+TIM)ReleaselinerThermalconductiveandvibrationdampingmaterial(lossfactorof0.9)Features■Dualfunctionthermalconductiveandvibrationdampingsheet.■Excellentvibrationcontrol.(lossfactor0.9)■Customprofilescanbeprovideduponrequest.■Silicone-free,nosiloxaneoutgassing.（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）TesttypeThermalConductivityColorThicknessSpecificGravityHardness＊1UnitW/m・KーmmーASKERCStandardJISR2616（Hot-wiremethod）ISO22007-2(HotDiscmethod)ーーJISZ8807JISK7312CPAG-TーMin.0.5（Softlayer：0.72）Black0.5／1.0／2.03.0／4.0／5.0Min.1.57(Softlayer:1.67)70CPAG0.80.72Black0.5／1.0／2.03.0／4.0／5.01.６７70TensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageTrackingresistanceDielectricconstant1MHzDurometertypeAMPa％Ω・cmkV/mmkV/mmーーJISK6253JISK6251JISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliantJISC2134CompanystandardA６４ーー5.54×1011ーーーーA64ーー5.54×1011ーーーーLosstangent1MHzーCompanystandardーーFlammabilityーUL94ーV-1equivalent(t2.0mm)V-0equivalent(t3.0-5.0mm)ReleaselinerLossFactorOperatingtempAvailablemax.dimension＊2ー℃mmHalf-powerbandwidthmethodーー０．９-10～100335×335*3０．９-10～100335×335*3＊1)MeasuredUltrasoft/Supersoft/Softlayer,minimum10mmstacked.＊2)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.＊3)t=0.5：200×200
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10Silicone-BasedThermalInterfaceMaterialsSiliconeCOOLPROVIDEＴＭ/SPVReleaselinerReleaselinerFeaturesSiliconebase3W/m·Kthermalconductivesheet■■Soft,highthermalconductivesheet.Minimalvolatile,low-molecularweightsiloxanegasforreducedPCBcontactfailure.（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）StandardーーJISZ8807JISK7312ASTMD2240JISK6251JISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliantJISC2134CompanystandardCompanystandardUL94ーーSPV3.02.3Green0.5／1.02.240690.49592.0×10110.690.3PLC:0(600Vorhigher)(t=3．０mm)35.10.07V-1(ｔ0.5ｍｍ)-20～125215×500UnitーｍｍーASKERCShore00MPa％Ω・cmkV/mmkV/mmーーーー℃ｍｍW/m・KTesttypeColorThicknessSpecificGravityTensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageTrackingresistanceFlammabilityOperatingtempAvailablemax.dimension＊2ThermalConductivityHardness＊1ISO22007-2(HotDiscmethod)JISR2616（Hot-wiremethod）＊1)MeasuredUltrasoft/Supersoft/Softlayer,minimum10mmstacked.＊2)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.Thermalconductivesiliconelayer（Softｌayer）ReleaselinerReleaselinerCOOLPROVIDEＴＭ/SPVSFeaturesSiliconebase5W/m·KthermalconductivesheetMinimalvolatile,low-molecularweightsiloxanegasforreducedPCBcontactfailure.Operatingtemperaturerange-20～125℃■■（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）StandardーーJISZ8807JISK7312ASTMD2240JISK6251JISK6251JISK6911compliantJISC2110-1compliantJISC2110-1compliantJISC2134CompanystandardCompanystandardUL94ーーSPVS5.03.4Green0.5／1.0／1.52.7570860.78163.0×10113.21.8PLC:0(600Vorhigher)(t=4.0mm)13.70.06V-０＊3-20～125200×500UnitーｍｍーASKERCShore00MPa％Ω・cmkV/mmkV/mmーーーー℃ｍｍW/m・KTesttypeColorThicknessSpecificGravityTensilestrengthElongationrateVolumeResistivityBreakdownvoltageWithstandingvoltageTrackingresistanceFlammabilityOperatingtempAvailablemax.dimension＊2ThermalConductivityHardness＊1ISO22007-2(HotDiscmethod)JISR2616（Hot-wiremethod）＊1)MeasuredUltrasoft/Supersoft/Softlayer,minimum10mmstacked.＊2)Forusabledimensions,customcuts,andmaterialyield,contactyourlocalsalesdepartment.＊3)1.5F:V-0equivalentThermalconductivesiliconelayer（Softｌayer）Dielectricconstant1MHzLosstangent1MHzDielectricconstant1MHzLosstangent1MHzHighConductivityHighConductivityHighConductivityHighConductivity
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11CERACOLD/CECDPorousceramic-basedheatsinkforexcellentheatdissipationFeaturesCeramicHeatSinkL2■Largersurfaceareaofporousceramicheatsinkimprovesthermalemissivityandheatdissipationcomparedtostandardaluminumheatsinks.■Ceramicheatsinksareapproximately30%lighterthanaluminumheatsinks.■Unlikemetalheatsinks,ceramicheatsinksdonotemitelectromagneticradiation.PartNumberThickness:tL1（Unit：ｍｍ）L2CECD-1.5-020020T1.52020L1CECD-3.0-020020T3.02020CECD-3.0-040040T3.04040tCeramicDouble-sidedadhesivetapeTesttypeThermalConductivityColorSpecificGravityVolumeResistivityOperatingtemp（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）UnitW/m・KーーΩ・cm℃StandardJISR2616（Hot-wiremethod）ーJISZ8807JISK6911compliantーＣＥＣＤ11.5Ｇｒｅｅｎ1.95≧108-40～125HeatdissipationefficiencyHeatconductivecharacteristicsComparisonofHeatSinkEfficiencyThermocouplePCBSpecimenHeatsourcePowersourceTemperatureofheatsource（℃）1005009090℃Noheatsink74℃Aluminumplate(t3mm)〈Testconditions〉Heatsource:□10mm(1.6W)Specimendimensions:□20mm(t3mm)68℃CECD(t3mm)EMInoiseissueswithmetalheatsinkStraycapacitanceoccursbetweentheICchip(noisesource)andtheheatsink(notgrounded),whichbecomesanantennaandemitsradiatednoise.CECDceramicheatsinkiselectricallyinsulating.CECDisnotaffectedbyelectrostaticcouplinganddoesnotfunctionasanantennatoradiatenoise.CeramicMetalICMetalheatsinkICCERACOLD
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GRAPHITEHYBRIDSHEET/GHS-2512Stackedlayersworktogethertopreventhotspotsandreturnedheattothedevice.Features■■■■Idealforattachingtotheinsideofplasticcaseofelectronicdevices.Lowthermalconductivitylayerreducesspeedofheattransfertographitelayer,preventshotspotsfromoccurring,andimpedesheatreflectionbacktotheheatsource.Onesideheat-resistantadhesivetape.Additionoflowheatreflectionlayer(BlackPETfilm+Lowthermalconductivitylater)helpstoreducethetemperatureofheatsource.HeatspreaderReleaselinerHeat-resistantadhesiveGraphitelayerHeat-resistantadhesiveLowthermalconductivitylayerBlackPETfilmThickness0.6mm（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）TesttypeThicknessThermalConductivity（Thicknessdirection＊１：wholeproduct)UnitｍｍW/m・KStandardーHot-wiremethod（Companystandard）GHS-250.63.0±1.0ThermalConductivityW/m・KLaserflashmethod（ASTME1461-13）≧1,400OperatingTemperature℃ー-40～150（Surfacedirection＊１：graphitelayeronly）＊1)PleaserefertoFigure1ontherightforthethermalconductivitymeasurementdirectionFigure1:ThermalConductivityMeasurementDirectionGraphitelayerSurfacedirectionGHS-25ThicknessdirectionPerformancecomparisonThermalanalysismodelTemperaturemeasurementpointonplasticboardPlasticboardt=2.0㎜(□70×70)GHS-25(□50×50)HeatingelementtemperatureUnit:℃Plasticboardtemperature2.０㎜HeatsourceMeasurementpointofheatingelementPCBNocountermeasuresGraphitesheetonly90.5103.7(+13.2)48.239.6(-8.6)GHS-2583.6(-6.9)35.9(-12.3)＜Conditions＞・Ambienttemperature:25℃・Noforcedconvection・Airbuoyancyconsidered・Analysissoftware:FemtetSpacerApplicationExampleStreamingdeviceSurfacetemperatureobservationWithoutsolution70°CGraphitesheetonlyGHS-25＊2＜Mountinglocation＞GHS-25＊2）WhenGHS-25wasapplied,CPUtemperaturewasreducedby3.2℃ascomparedtonothermalsolution.20°C
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13HEATSPREADERSHEET/HSDThinandflexibleheatspreadingsheetforsuperiorthermalmanagementHeatspreader■■■■FeaturesAluminumheatspreadermaterialwithexcellentthermalconductivity.(221W/m·K)Spreadsheatawayfromhotspotstocoolerareastopreventcomponentsfromoverheating.Optionalelectricallyinsulatingmylar(PET)layercanbeapplieduponrequest.Idealthermalsolutionforhotspotsonspaceconsciousapplicationssuchasmobiledevices,tablets,routers,videostreamingdevices,etc.HSD-0.22HSD-0.30Aluminumfoil（100μm）Adhesivelayer(120μm)ReleasepaperAluminumfoil（200μm）Adhesivelayer(100μm)Releasepaper（Thevaluesaremeasuredvalues,butnottheproductspecificationsorguaranteed.）TesttypeUnitStandardHSD-0.22HSD-0.30ThicknessSurfaceThermalConductivityAdhesionｍｍW/m・KN/25mmーJISR2616（Hot-wiremethod）JISZ0237:2009０．２２０．30221(aluminum)＞１６＞11FlammabilityーULーーOperatingtemp℃ー-20～１００HeatDissipationEffectheatdistributionNoheatsinkHSD-0.22HSD-0.30TestSample①②③①②③PETfilm（30μm）Aluminumfoil（100μm）Adhesivelayer（120μm）PETfilm（30μm）Aluminumfoil（200μm）Adhesivelayer（100μm）TestingmethodHSDSeriesHeatDissipationEffectThermocoupleThermographySpecimenHeatsourcePowersourceTemperatureofheatsource(℃)90807060504030201083.859.659.3PCB0NoheatspreaderHSD-0.22HSD-0.30
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Terminologies14Low-molecular-weightsiloxaneThenumberofdimethylsiloxanemoleculesinthesequenceisoftenreferredtoasD3(trimer),D4(tetramer),orD5(pentamer),andsoon.ThemoleculesuptoD20arecalled"lowmolecularweightcyclicsiloxane".Inparticular,thetotalvolumeofD3throughD10isusedasareferenceforthesilicone'squality.(ReferencedfromWikipedia)
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